Principal Microelectronics Engineer - (64066)
Company: Knewin
Location: Costa Mesa
Posted on: April 30, 2024
Job Description:
Viking Technology, a division of Sanmina Corporation, leads the
Enterprise and Embedded server and storage market in Solid State
Drives (SSD), DRAM, and hybrid storage technologies. With a breadth
of solutions that bridge both SSD and DRAM, Viking Technology has
the ability to deliver any storage solution from high-performance
computing SSDs down to embedded kiosk flash devices. Viking
Technology has over two decades of focused storage and DRAM
development, delivering high technology solutions that optimize the
value and performance of customers' applications in the Enterprise,
Network Infrastructure, Embedded, and Defense & Aerospace markets.
With an extensive product breadth of SSD and DRAM, Viking
Technology stands as one of the top Tier storage solution provider
in the market. Job Purpose: Candidate will lead the design and
development of innovative microelectronics packaging solutions for
high density memory products targeted at the defense, aerospace,
and commercial markets. Nature of Duties/Responsibilities:
- Lead a team of engineers and subcontractors in the development
and qualification of DRAM and Flash products including multichip
modules (MCM), plastic ball grid array multichip packages (MCP),
and System-In-Package (SiP) solutions.
- Responsible for project scheduling and execution, project
status reporting, and providing technical guidance to the
team.
- Interface directly with onshore and offshore assembly and test
subcontractors (OSAT) and OEM customers.
- Some travel may be required. Education and Experience:
- Minimum 10-12 years related experience.
- BS in Microelectronics Packaging, EE, Mechanical Engineering,
Physics, or Materials
- Experience in the design of semiconductor packages such as
plastic ball grid arrays, MultiChip Packages (MCPs), and
System-in-Package (SiP).
- Solid understanding of semiconductor package design parameters
and their influence on cost, thermal and electrical performance,
reliability, and manufacturability
- Experience leading cross-functional engineering teams in
complex microelectronics packaging projects.
- Project management experience including scheduling, status
reporting, and subcontractor management.
- Thorough understanding of microelectronics package design flow,
including mechanical design, signal integrity simulation, thermal
simulation, schematic capture, and PCB layout
- Thorough understanding of high volume manufacturing processes
for semiconductor ICs (backend packaging and test)
- Familiarity with silicon wafer post-process techniques such as
wafer thinning, dicing, and RDL application.
- T horough understanding and experience in packaging
qualification testing techniques and industry standard test
methods
- Experience interfacing directly with onshore and offshore
microelectronics assembly and test subcontractors (OSAT)
- Experience with printed circuit board assembly, SMT processing
equipment and methods
- Familiarity with integrated circuit functional test and burn in
techniques.
- Excellent verbal and written communication skills PACKAGING
Skills
- Wafer level packaging, Wafer preparation (dicing, grinding,
wafer expansion, die singulation)
- Die pick and place, Die Attach, Die Stack, MEMS die, FLIP CHIP,
Underfill, Thermo-compression bonding, WIREBOND, Molding (transfer
mold)
- Compression mold, vacuum mold, film-assist mold), Dam and Fill
dispense, Ball Attach, Solder Reflow, Singulation, Tape and Reel,
SMT (Surface Mount Technology). Packages handled and developed:
QFP, TQFP, SOP, TSOP, QFN, Flip Chip, Cu pillar FC, BGA, CSP,
FAN-OUT WAFER LEVEL PACKAGING (FOWLP), 2.5DIC, 3DIC, Thru mold
vias, Thru-silicon Sanmina is an Equal Opportunity Employer -
M/F/Veteran/Disability/Sexual Orientation/Gender Identity This is
an ITAR facility. Must be US Citizen or lawful permanent
resident.
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Keywords: Knewin, Compton , Principal Microelectronics Engineer - (64066), Engineering , Costa Mesa, California
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